Ceramic heat dissipation circuit board

substrate material: 96% Al2O3

Layers: 2
Thickness: 0.5mm
Cu PCB for high power LED light
Substrate material: Copper
Copper thickness: 35um
Plating process: Immersion gold
Description: Power LED MCPCB
Countersink holes

In COB packaging, no additional BT board is used, but the LED chip is directly packaged on the PCB board. With short heat conduction channel and better heat dissipation performance, it is more suitable for high pixel density display. COB packaging has the highest degree of integration, which can theoretically achieve the minimum pixel spacing, the highest reliability and the longest display life. It is the best packaging scheme for Micro LED.