Metallized Ceramics Applications:
Feed-through insulators, Headers, High-power receptacles, Insulating discs, Insulator rings and cylinders, Precipitator products, Power switches, Traveling wave tubes, Vacuum interrupters, Windows, Power grid tubes, X-ray tubes Joining types:
Ceramic + Mo/Mn Metallized + plating Ni
Ceramic + Mo/Mn Metallized + plating Ag
Ceramic + Mo/Mn Metallized + plating Au
Ceramic + printing Ag
Special types are available according to customer's drawings or samples.
Various size to very tight dimensional tolerances.
Excellent mechanical, electrical and thermal characteristics.
Various sizes and pattern design
Excellent bonding strength.
Why metallize the ceramic?
Ceramics are usually non-conductive insulators. In order to transport electrons in a specific manner or prepare the ceramic for a solder/braze attach the substrate is generally coated via a screen-printer, lathe, automatic dispenser, spin-coater, etc. After metallization and nickel plating, the ceramic is ready to be soldered into a circuit or package. Active metal brazing makes it possible to join ceramic and other materials without the metallization step. Active metal brazing is very robust, creates vacuum tight joints and has proven very effective over the years. Active metal brazing is done in a vacuum environment and there are some limitations to its application. Conventional brazing, on the other hand, requires metallization because without the metallized layer there will be no adhesion of the molten solder/braze material and there will be no practical joint formed. Here is a simple experiment - drop molten solder (AgSn works well) onto a bare ceramic piece. Note the adhesion of ceramic to metal and vice versa.